Invensense公司成立于2003年6月，总部位于美国Sunnyvale。主要生产的产品为运动感测追踪组件。投资方包括Artiman Ventures、Partech International、Sierra Ventures和高通。该公司计划将技术推广消费电子设备，例如游戏掌机、智能手机、平板电脑、照相机、导航设备和玩具等。

InvenSense为智能型运动处理方案的先驱、全球业界的领导厂商，驱动了运动感测人机接口在消费性电子产品上的应用。公司提供的集成电路(IC)整合了运动传感器-陀螺仪以及相对应的软件，有别于其他厂商，有着小尺寸、高整合、高性能、高可靠度与低价格的优势。公司产品可应用于众多市场上。

InvenSense公司拥有四种专有技术优势：专利的Nasiri-Fabrication制程，先进的MEMS陀螺仪设计，可提供传感器讯号处理方案(signal processing)及运作本司运动处理平台(Motion Processing)关键之融合算法技术(Sensor Fusion)的混合讯号电路系统(mixed-signal circuitry)，以及本公司的运动处理数据库与运动感测应用(Motion Application)软件方案。因本公司可组装、可扩展的平台架构，从一轴的模拟陀螺仪，到完整整合之三轴与六轴的数字运动处理方案为止，InvenSense公司能提供市场多种整合性运动感测产品。

2016年底，TDK宣布以13.3亿美元收购InvenSense。

InvenSense, Inc. (NYSE: INVN) is the world’s leading provider of MEMS sensor platforms found in Mobile, Wearables, Smart Home, Industrial, and Automotive products. The company’s patented InvenSense Fabrication Platform, MotionFusion® technology, and location software and services addresses the emerging need of many mass-market consumer applications via improved performance, accuracy, and intuitive motion-, gesture- and sound-based interfaces.

MotionTracking is rapidly becoming a key function in every consumer electronics device as it provides a more intuitive way for consumers to interact with their electronic devices by tracking their motions in free space and delivering these motions as input commands. Audio is similarly becoming complementary to motion as a means for interacting with contextually aware devices and applications. InvenSense’s vision is to be the leading provider of sensor Systems on Chips (SoC) platform solutions providing an ‘AlwaysOn’ solution by enabling the most seamless sensing experience at the lowest power.

InvenSense’s microphone portfolio builds on a strong heritage of industry firsts, including continuous improvement of MEMS microphone SNR, ever-higher integration levels, and even lower power consumption. InvenSense combines the capability to sense audio along with cutting-edge motion detection, which is important for many contextual awareness applications.

InvenSense MotionTracking portfolio accurately tracks complex user motions requires the use of motion sensors such as gyroscopes, accelerometers, compasses, and pressure sensors, properly calibrating the data, and then fusing the sensor outputs into a single and accurate data stream for use by motion applications. InvenSense delivers turn-key solutions with fully integrated MotionTracking devices, robust MotionFusion algorithms, and in-use calibration firmware. The company’s patented InvenSense Fabrication process is the key technology which enables direct integration of MEMS mechanical structures with CMOS electronics at the wafer level.

InvenSense MotionTracking technology is comprised of five core proprietary elements: the InvenSense Fabrication process, advanced MEMS motion sensor designs, application specific mixed-signal circuitry for sensor signal processing, MotionFusion algorithms and calibration firmware that intelligently assimilates data from multiple sensors for use by end applications, and the MotionApps™ platform of drivers and application programming interfaces (APIs). Although all five elements are critical to providing a complete MotionProcessing solution, the patented InvenSense Fabrication platform is the core differentiating technology. As a result of our modular and scalable platform architecture, our current and planned products span increasing levels of integration, from standalone single-chip gyroscopes to fully integrated sensor system on chip (SoC) MotionTracking solutions.

Founded in 2003, InvenSense is headquartered in San Jose, California and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia and Italy.

InvenSense’s vision of Sensing Everything™ targets the consumer electronics and industrial markets with integrated Motion and Sound solutions. Our solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy.

InvenSense was the first company to deliver Motion Interface solutions with fully integrated sensors and robust MotionFusion™ firmware algorithms. Our MotionTracking™ devices enable our customers to integrate Motion Interface capability directly into devices, easily and with minimal development cost and effort. InvenSense is a pioneer and leader in our industry, consistently delivering game changing solutions. We began with the world’s first dual-axis MEMS gyroscopes in 2006 for the digital still camera market, the world’s first integrated 3-axis motion processing solution for smart phones in 2009, the world’s first single-chip integrated 6-axis MotionTracking™ device in 2010, the world’s first integrated 9-axis MotionTracking™ device in 2012; and in 2014, the ICM-20728, the world’s first integrated 7-axis (3-axis gyroscope + 3-axis accelerometer + pressure sensor) single-chip platform solution with onboard Digital Motion Processor (DMP™).

Introducing the FireFly product family, the world’s first Sensor System on Chip platform integrating MEMS sensors with multi-core digital sensor processors, embedded ARM, memory, and an open software framework. The integrated sensor processors are designed to collect and process data from internal and external sensors for data classification, runtime calibration, and fusion, thereby saving system power and improving performance.  The InvenSense Software Framework, in combination with industry standard ARM tool chain, provides an open and powerful platform for creating cutting-edge ‘AlwaysOn’ applications across many product segments. FireFly products from InvenSense function as a sensor hub that developers can use to rapidly develop and launch new sensor based features. 

First in the FireFly platform of products is the new InvenSense ICM-30670 which disrupts the traditional discrete sensor subsystem in many applications by providing a true turn-key and open solution in the same footprint as competitive sensor-only devices (3mm x 3mm x 1mm LGA package).